Flaky compound to prevent computer chips from getting fried

A research team from Skoltech has improved the properties of a polymer used in 3D printing. By adding boron nitride "flakes" to the photopolymer, the scientists managed to double the material's thermal conductivity. This could prevent microchips encapsulated with the polymer from overheating and thus enable microelectronic devices that are smaller and more powerful. The paper has been published in Polymers.